Thinning or back grinding wheel By More Super Hard Products Co., Ltd,
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Thinning or back grinding wheel

Prix FOB

Obtenir le dernier prix

( Negotiable )

|

1 Piece Minimum Order

Pays:

China

N ° de modèle:

-

Prix FOB:

( Negotiable ) Obtenir le dernier prix

Localité:

china

Prix de commande minimale:

-

Commande minimale:

1 Piece

Packaging Detail:

box

Heure de livraison:

5-10days

Capacité de Fournir:

3000 Piece per Month

Payment Type:

D/A, L/C, T/T

Groupe de produits :

-

Contacter maintenant
More Super Hard Products Co., Ltd

More Super Hard Products Co., Ltd

China

Membre gratuit

Personne à contacter Mr. Anna

Zhengzhou,Henan,China, Zhengzhou, Henan

Contacter maintenant

Spécification du produit

  • Brand Name: More super hard
  • Shape: Cylindrical
  • Abrasive: Diamond
  • Bonding Agent: Ceramic

La description

Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.

Coolant: Oil, emulsion

whatsapp *********8/***3

workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Specifications

1.be used with Japanese, German, American, Korea and Chinese grinders 

2.superior grinding performance 

3.high cost performance

 





















































 
Shape code Profile Sketch Conventional Specification (mm)
Out diameter D Thickness

T		 Hole diameter H
6A2   **5 *0, *5 *6
**0 *5 *6
**5 *0 **7
6A2T   **5 *2.5, *5 **0
**0 *0 **8.6
**0 *5 **5
6A2T-   **9 *2.5 **8

 

Application: back thinning, grinding and fine grinding.

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials. 

Grinders: SHUWA SGM****1, NTS Nanosurface***0G, NTS Nanosurface **0/NC-VDM

Pays: China
N ° de modèle: -
Prix FOB: ( Negotiable ) Obtenir le dernier prix
Localité: china
Prix de commande minimale: -
Commande minimale: 1 Piece
Packaging Detail: box
Heure de livraison: 5-10days
Capacité de Fournir: 3000 Piece per Month
Payment Type: D/A, L/C, T/T
Groupe de produits : -

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Mots-clés correspondants

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Mr. Anna < More Super Hard Products Co., Ltd >

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